The increase in data rates and processing speeds driven by AI, next-generation digital and RF device complexity, require more precise filtering, improved signals, and power with less noise. This discussion will focus on the newest studies showing how including ultra-thin and high Dk laminates in PCBs improve space utilization, stack-up thicknesses, EMC, SI and PI. Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, Fabricator Engineer/Operator, Assembly Engineer/Operator Level of complexity: Beginner, Intermediate
SpeakerCredentials
John Ranieri
